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For the Inventor, By the Inventor

Scottsdale, AZ, United States of America

Dervin L Flowers

This inventor holds 10 USPTO granted patents. Top assignee: Motorola Corporation. Active years: 1976-1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dervin L Flowers. Retrieved from https://idiyas.com/inventor/dervin-l-flowers

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 1.4

ph-index = 5

Forward Citations = 95(Granted Patents)


Company Filing History:

goldMedal10 out of 20,290 
 
Motorola Corporation
 patents

Years Active: 1976-1990

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10 patents (USPTO):Explore Patents
1. 4946518 - Method for improving the adhesion of a plastic encapsulant to copper (1990-08-07),
2. 4521441 - Plasma enhanced diffusion process (1985-06-04),
3. 4381213 - Partial vacuum boron diffusion process (1983-04-26),
4. 4200463 - Semiconductor device manufacture using photoresist protective coating (1980-04-29),
5. 4187599 - Semiconductor device having a tin metallization system and package (1980-02-12),
6. 4010143 - Molding compound containing N-methyl-Z pyrrolidone and method (1977-03-01),
7. 4009299 - Tin strip formulation for metal to glass seal diodes (1977-02-22),
8. 3963500 - Semiconductor wafer corrosion protection solution (1976-06-15),
9. 3954498 - Aluminum foil cleaning process (1976-05-04),
10. 3932685 - Aluminum stabilization process and stabilization solution therefor (1976-01-13),

Title: Innovations by Dervin L. Flowers: A Pioneer in Semiconductor Technology

Introduction

Dervin L. Flowers, based in Scottsdale, AZ, is an esteemed inventor known for his remarkable contributions to the field of semiconductor technology. With a total of 10 patents to his name, Flowers has made significant strides in improving electronic component reliability and efficiency.

Latest Patents

Among his latest innovations, two patents stand out. The first is a method for enhancing the adhesion of plastic encapsulants to electrical leadframes composed of substantial copper. This innovative approach involves exposing leadframes to an active oxygen ambient, allowing for improved adhesion without the need to remove the native oxide layer. This treatment enhances the strength of the oxide, resulting in reduced delamination during temperature cycling between -65°C and 150°C.

His second recent patent pertains to a plasma-enhanced diffusion process that enables lower sheet resistivity in semiconductor substrates. By applying a spin-on dopant material and treating it with oxygen plasma, this method optimizes diffusion properties and achieves desired depths of diffusion through precise heating.

Career Highlights

Dervin L. Flowers has spent a significant portion of his career at Motorola Corporation, where he has been instrumental in developing technologies that enhance semiconductor performance. His innovative work has not only contributed to the reliability of electronic components but has also positioned him as a thought leader in the industry.

Collaborations

Throughout his career, Flowers has collaborated with notable colleagues such as Richard L. Greeson and V. Louise Rice. These collaborations have further enriched his research and development efforts, leading to numerous breakthroughs in electronic manufacturing processes.

Conclusion

Dervin L. Flowers continues to be a driving force in the innovation of semiconductor technologies. His patents reflect a commitment to improving electronic performance and reliability, making him a respected figure in the world of inventions and innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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