The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 07, 1990

Filed:

Mar. 14, 1989
Applicant:
Inventors:

Keith G Spanjer, Scottsdale, AZ (US);

Dervin L Flowers, Scottsdale, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
148282 ; 148276 ; 148284 ; 26427217 ;
Abstract

The adhesion of plastic encapsulants to electrical leadframes containing substantial amounts of copper is improved by exposing the leadframes to an active oxygen ambient (e.g., 10-30% H.sub.2 O.sub.2) at temperatures below the leadframe annealing temperature (e.g., room temperature to 100.degree. C.) for a few minutes. There is no need to remove the native oxide. A preliminary degreasing step is desirable but not essential. The treatment strengthens any native oxide present on the leadframes without producing an oxide which is so thick as to interfere with subsequent bonding of electronic components or connecting wires to the leadframe. Delamination between the leadframe and the plastic encapsulant by temperture cycling from -65.degree. to 150.degree. C. is substantially reduced.


Find Patent Forward Citations

Spanjer, Keith. (1990). Method for improving the adhesion of a plastic encapsulant to copper (U.S. Patent No. 4946518). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4946518

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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