The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 1980

Filed:

May. 22, 1978
Applicant:
Inventors:

Dervin L Flowers, Scottsdale, AZ (US);

Richard L Greeson, Scottsdale, AZ (US);

V Louise Rice, Phoenix, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01J / ;
U.S. Cl.
CPC ...
29588 ; 29590 ; 228188 ;
Abstract

An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of impervious material, a semiconductor device having the metallization system of this invention disposed in the housing and conductor means bonded to the tin on the semiconductor device is also disclosed. The system is of particular usefulness in double stud diode packages.


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Flowers, Dervin. (1980). Semiconductor device having a tin metallization system and package (U.S. Patent No. 4187599). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4187599

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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