This inventor holds 2 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Henkel IP Holding Gmbh, Henkel Ag & Company, Kgaa. Active years: 2017-2021.
Company Filing History:
2 out of 396 
1 out of 4,532 
Years Active: 2017-2021
Title: The Innovative Contributions of Derek Wyatt
Introduction
Derek Wyatt is a notable inventor based in Mission Viejo, CA (US). He has made significant contributions to the field of electronic packaging through his innovative patents. With a total of 2 patents, Wyatt's work focuses on enhancing electromagnetic interference (EMI) shielding in electronic devices.
Latest Patents
Wyatt's latest patents include "Compositions for gap coating and/or filling in or between electronic packages by capillary flow and methods for the use thereof." This invention provides conductive formulations that improve EMI shielding performance compared to prior art formulations. The methods utilize capillary flow to effectively fill gaps in electronic packages, demonstrating effective EMI shielding with minimal coating thickness. Another significant patent is "Underfill composition and packaging process using the same," which presents a one-part liquid underfill composition comprising an epoxy resin and other components, along with a packaging process utilizing this underfill composition.
Career Highlights
Throughout his career, Derek Wyatt has worked with prominent companies such as Henkel IP Holding GmbH and Henkel AG & Company, KGaA. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic packaging.
Collaborations
Wyatt has collaborated with talented individuals in his field, including Xuan Hong and Xinpei Cao. These collaborations have likely enriched his work and led to further advancements in his inventions.
Conclusion
Derek Wyatt's contributions to the field of electronic packaging through his innovative patents demonstrate his commitment to improving technology. His work continues to influence the industry and pave the way for future advancements.