The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Jul. 21, 2015
Applicants:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Ablestik (Shanghai) Ltd., Shanghai, CN;
Inventors:
Xiaolong Hu, Shanghai, CN;
Derek Wyatt, Mission Viejo, CA (US);
Jiong England, Orange, CA (US);
Paul J. Gleeson, Torrance, CA (US);
Renfel He, Shanghai, CN;
Assignees:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Henkel IP & Holding GmbH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/10 (2006.01); H01L 23/29 (2006.01); C08K 3/04 (2006.01); C08G 59/40 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
C09J 163/10 (2013.01); C08G 59/40 (2013.01); C08K 3/04 (2013.01); H01L 23/293 (2013.01); C08K 2003/045 (2013.01); H01L 21/563 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/19105 (2013.01);
Abstract
The present invention provides a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.