The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 2021

Filed:

Nov. 13, 2018
Applicant:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventors:

Xuan Hong, Irvine, CA (US);

Xinpei Cao, Irvine, CA (US);

Derek Wyatt, Mission Viejo, CA (US);

Qizhuo Zhuo, Irvine, CA (US);

Elizabeth Hoang, Orange, CA (US);

Assignee:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/3205 (2006.01); H01L 21/56 (2006.01); H01B 1/22 (2006.01); C09D 163/00 (2006.01); C09D 5/24 (2006.01); C09D 5/32 (2006.01); C09D 7/40 (2018.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); C09D 5/24 (2013.01); C09D 5/32 (2013.01); C09D 7/67 (2018.01); C09D 7/68 (2018.01); C09D 7/69 (2018.01); C09D 163/00 (2013.01); H01B 1/22 (2013.01); H01L 21/32056 (2013.01); H01L 21/56 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

Provided herein are conductive formulations which are useful for applying conductive material to a suitable substrate; the resulting coated articles have improved EMI shielding performance relative to articles coated with prior art formulations employing prior art methods. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. Specifically, invention methods utilize capillary flow to substantially fill any gaps in the coating on the surface of an electronic package. Effective EMI shielding has been demonstrated with very thin coating thickness.


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