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For the Inventor, By the Inventor

Dereje Agonafer

Poughkeepsie, NY, United States of America

Dereje Agonafer

LinkedIn
USPTO Granted Patents = 10

Average Co-Inventor Count = 3.2

ph-index = 7

Forward Citations = 320(Granted Patents)


Location History:

  • Poughkeepsie, NY (US) (1988 - 1998)
  • Grand Prairie, TX (US) (2002)
  • Southlake, TX (US) (2002 - 2016)
  • Arlington, TX (US) (2021)

Company Filing History:

goldMedal8 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal2 out of 5,444 
 
University of Texas System
 patents

Years Active: 1988-2021

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10 patents (USPTO):Explore Patents
1. 10962297 - Multidimensional heat transfer system for cooling electronic components (2021-03-30),
2. 9360514 - Thermal reliability testing systems with thermal cycling and multidimensional heat transfer (2016-06-07),
3. 6431260 - Cavity plate and jet nozzle assemblies for use in cooling an electronic module, and methods of fabrication thereof (2002-08-13),
4. 6337794 - Isothermal heat sink with tiered cooling channels (2002-01-08),
5. 5719745 - Extended surface cooling for chip stack applications (1998-02-17),
6. 5704419 - Air flow distribution in integrated circuit spot coolers (1998-01-06),
7. 5644687 - Methods and system for thermal analysis of electronic packages (1997-07-01),
8. 5482113 - Convertible heat exchanger for air or water cooling of electronic (1996-01-09),
9. 5370178 - Convertible cooling module for air or water cooling of electronic (1994-12-06),
10. 4757370 - Circuit package cooling technique with liquid film spreading downward (1988-07-12),
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