The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 2021

Filed:

Feb. 21, 2012
Applicants:

Dereje Agonafer, Arlington, TX (US);

Huy N. Phan, Fort Worth, TX (US);

Inventors:

Dereje Agonafer, Arlington, TX (US);

Huy N. Phan, Fort Worth, TX (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28D 15/00 (2006.01); F28D 15/02 (2006.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01); H01L 23/38 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0266 (2013.01); H01L 23/38 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Devices, methods, and systems for facilitating heat transfer and cooling electronic components are presented. A system for cooling an electronic component includes a cold core, a plurality of solid state cooling devices, and a plurality of heat sinks. The cold core may define one or more cavities for receiving electronic components. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures. In other embodiments, the system may include multiple cold cores connected by liquid conduits for facilitating a flow of a cooling fluid.


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