The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 07, 2016

Filed:

Mar. 14, 2013
Applicants:

Huy N. Phan, Fort Worth, TX (US);

Dereje Agonafer, Southlake, TX (US);

Inventors:

Huy N. Phan, Fort Worth, TX (US);

Dereje Agonafer, Southlake, TX (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/10 (2006.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 31/003 (2013.01); G01R 31/2874 (2013.01); G01R 31/2862 (2013.01);
Abstract

Devices, methods, and systems for facilitating heat transfer around an electronic component during thermal-cycle testing are presented. A system may include a core, a plurality of solid state heating/cooling devices, and a plurality of heat sinks. The core defines one or more cavities for receiving an electronic component. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures and heat it to above the boiling point of water. A method of thermal-cycle testing may include a core defining a cavity for receiving an electronic component, selectively inducing said heating/cooling devices to operate in a heating mode or a cooling mode, and measuring and recording conditions during the test.


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