This inventor holds 1 USPTO granted patent. Top assignee: Winbond Electronics Corporation. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: The Innovative Mind of Dennis Cheng: Revolutionizing Semiconductor Technology
Introduction: Dennis Cheng, an accomplished inventor based in Fremont, CA, has made significant strides in the field of semiconductor technology with his groundbreaking patent.
Latest Patents: Dennis Cheng holds a remarkable patent for "Semiconductor wafers and testing methods thereof." This invention introduces a novel approach to semiconductor wafer design, incorporating a die area, a scribe area, a die with a main circuit, and a testing circuit for efficient testing of the main circuit.
Career Highlights: Currently affiliated with Winbond Electronics Corporation, Dennis Cheng continues to push the boundaries of innovation in the semiconductor industry. His dedication and ingenuity have led to the development of cutting-edge technologies that redefine the landscape of semiconductor manufacturing.
Collaborations: Throughout his illustrious career, Dennis Cheng has collaborated with esteemed colleagues such as Hsi-Hsien Hung and Johnny Chan. Together, they have fostered a culture of innovation and excellence within the semiconductor industry, driving forward progress and pioneering new solutions.
Conclusion: Dennis Cheng's unwavering commitment to innovation and his profound impact on semiconductor technology underscore his position as a trailblazer in the field. With a keen focus on advancing the boundaries of what is possible, Cheng's contributions continue to shape the future of semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile