The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Feb. 12, 2014
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 31/28 (2006.01); G09C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2607 (2013.01); G01R 31/2884 (2013.01); G09C 1/00 (2013.01); H04L 2209/12 (2013.01);
Abstract
The invention provides a semiconductor wafer with a die area and a scribe area, and the semiconductor wafer includes a die and a testing circuit. The die is formed on the die region of the semiconductor wafer, and the die includes a main circuit. The testing circuit is disposed on the scribe area of the semiconductor wafer, and is electrically connected to the die for testing the main circuit.