Denise P Czech

Title: Denise P. Czech and MEMS Packaging Innovations.

Introduction

Denise P. Czech is an inventor associated with Schaumburg, Illinois, and Knowles Electronics, Inc. Her patent work focuses on manufacturing methods for microelectromechanical systems (MEMS) packages. She is credited with 2 patents.

Latest Patents

Czech’s listed patents share the title “MEMS Package and a Method for Manufacturing the Same.” They describe approaches to producing multiple MEMS transducer packages efficiently.

One method places transducers on a panel of undivided package substrates, attaches individual covers over the transducers, deposits epoxy into channels between the covers, and then singulates the panel into separate packages.

A related method applies an adhesive to a substrate, positions and couples multiple covers to it, deposits material into the channels formed by the covers and substrate, and processes the material to secure it. The packages are then separated by singulating along the channels.

Career Highlights

The available patent information highlights Czech’s contributions to MEMS package manufacturing, particularly processes for assembling and separating multiple packages. Her work is associated with Knowles Electronics, Inc.

Collaborations

Czech’s listed coworkers include Kurt B. Friel and Lawrence A. Grunert. Their names appear alongside her work on MEMS packaging patents.

Conclusion

Denise P. Czech’s patent record reflects a focus on practical manufacturing techniques for MEMS packages, including cover attachment, channel filling, and package singulation.