The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Aug. 13, 2010
Applicants:

Peter V. Loeppert, Hoffman Estates, IL (US);

Denise P. Czech, Schaumburg, IL (US);

Lawrence A. Grunert, Lombard, IL (US);

Kurt B. Friel, Sycamore, IL (US);

Qing Wang, Bloomingdale, IL (US);

Inventors:

Peter V. Loeppert, Hoffman Estates, IL (US);

Denise P. Czech, Schaumburg, IL (US);

Lawrence A. Grunert, Lombard, IL (US);

Kurt B. Friel, Sycamore, IL (US);

Qing Wang, Bloomingdale, IL (US);

Assignee:

Knowles Electronics, LLC, Itasca, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 21/56 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); B81B 7/0061 (2013.01); B81B 2201/0257 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.


Find Patent Forward Citations

Loading…