The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Feb. 26, 2015
Applicant:
Knowles Electronic Llc, Itasca, IL (US);
Inventors:
Peter V. Loeppert, Durand, IL (US);
Denise P. Czech, Schaumburg, IL (US);
Lawrence A. Grunert, Lombard, IL (US);
Kurt B. Friel, Sycamore, IL (US);
Qing Wang, Hanover Park, IL (US);
Assignee:
Knowles Electronics LLC, Itasca, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/00 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00888 (2013.01); B81B 7/0061 (2013.01); B81B 7/0064 (2013.01); H01L 21/56 (2013.01); H01L 24/97 (2013.01); B81B 2201/0257 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/019 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.