Company Filing History:
Years Active: 2012-2023
Title: The Innovations of Denis Amparo
Introduction
Denis Amparo is a notable inventor based in White Plains, NY (US), recognized for his contributions to the field of superconducting technology. With a total of nine patents to his name, Amparo has made significant strides in the development of advanced electronic systems.
Latest Patents
One of his latest patents is titled "System and method for superconducting multi-chip module." This innovative method involves bonding two superconducting integrated circuits, or chips, in a way that allows for electrical interconnection. The process utilizes a plurality of indium-coated metallic posts deposited on each chip. The indium bumps are aligned and compressed under moderate pressure at a specific temperature, allowing the indium to deform without melting. This results in fully superconducting connections between the chips once cooled to the superconducting state. An anti-diffusion layer can be applied beneath the indium bumps to prevent reactions with underlying layers. This method is scalable for a large number of small contacts on a wafer scale and can be used to manufacture multi-chip modules that include multiple chips on a common carrier. Such advancements have implications for the packaging of superconducting classical and quantum computers, as well as superconducting sensor arrays.
Career Highlights
Throughout his career, Denis Amparo has worked with prominent companies in the technology sector, including Hypres, Inc. and Seeqc Inc. His work has focused on pushing the boundaries of superconducting technologies and their applications in modern computing.
Collaborations
Amparo has collaborated with notable colleagues such as John Vivalda and Daniel Yohannes, contributing to the advancement of superconducting systems and their integration into practical applications.
Conclusion
Denis Amparo's innovative work in superconducting technology and his numerous patents highlight his significant contributions to the field. His advancements pave the way for future developments in superconducting electronics and computing systems.