Hypres, Inc.

Seeqc Inc.

Other

Denis Amparo

Daniel Yohannes

John Vivalda

Sergey K Tolpygo

Richard Hunt

Oleg A Mukhanov

Amol Ashok Inamdar

Igor V Vernik

Mario Renzullo

Oleksandr Chernyashevskyy

Jason Walter

Jie Ren

Andrei Talalaeskii

Andrei Talalaevskii

A method for bonding two superconducting integrated circuits ('chips'), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

System and method for superconducting multi-chip module

Superconducting integrated circuits require several wiring layers to distribute bias and signals across the circuit, which must cross each other both with and without contacts. All wiring lines and contacts must be fully superconducting, and in the prior art each wiring layer comprises a single metallic thin film. An alternative wiring layer is disclosed that comprises sequential layers of two or more different metals. Such a multi-metallic wiring layer may offer improved resistance to impurity diffusion, better surface passivation, and/or reduction of stress, beyond that which is attainable with a single-metallic wiring layer. The resulting process leads to improved margin and yield in an integrated circuit comprising a plurality of Josephson junctions. Several preferred embodiments are disclosed, for both planarized and non-planarized processes. These preferred and other methods may be applied to digital circuits based on Rapid Single Flux Quantum logic, and to quantum computing using Josephson junction qubits.

System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits

A superconducting circuit is disclosed for fast digital readout of on-chip diagnostics in an array of devices in an integrated circuit. The digital readout comprises a digital RSFQ multiplexer to select the readout channel. This permits a large number of devices to be tested with a minimum of input and output lines. The devices may comprise digital devices (such as elementary RSFQ cells), or analog devices (such as inductors, resistors, or Josephson junctions) with a SQUID quantizer to generate a digital signal. The diagnostic array and the digital multiplexer are preferably configured to operate as part of the same integrated circuit at cryogenic temperatures.

System and method for array diagnostics in superconducting integrated circuit

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White Plains, NY, United States of America

Denis Amparo