Company Filing History:
Years Active: 2001
Title: Innovator De-Ming Liang: Pioneering Chip Overlay Performance
Introduction
De-Ming Liang, an accomplished inventor located in Hsin-Chu, Taiwan, has made significant contributions to the field of semiconductor engineering. With a focus on ensuring the accuracy of chip images, Liang's work represents a remarkable blend of innovation and practical application, addressing a critical aspect of chip manufacturing.
Latest Patents
Liang holds a patent for a groundbreaking method titled "Frame layout to monitor overlay performance of chip composed of multi-exposure images." This invention provides a frame layout and method to determine the overlay accuracy of a first chip image relative to a second chip image. By employing techniques such as a vernier scale in orthogonal directions and a box-in-box pattern, this patent enhances the understanding of overlay accuracy essential for chip formation. When photoresist on an integrated circuit wafer is exposed with these images, the patent allows for direct assessment of overlay accuracy.
Career Highlights
De-Ming Liang is currently affiliated with Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His work in this company has solidified his status as an important contributor to advancements in chip technology.
Collaborations
Liang has collaborated with notable professionals in the field, including Chia-Hsiang Chen and Chih-Chien Hung. Together, these innovators work towards continuous improvement of semiconductor fabrication processes, showcasing the power of teamwork in driving technological progress.
Conclusion
In summary, De-Ming Liang is an influential inventor whose patent addressing chip overlay performance is a testament to his innovative spirit. His contributions to Taiwan Semiconductor Manufacturing Company Limited and collaborations with fellow engineers further underline his commitment to advancing semiconductor technology. As the industry continues to evolve, Liang's work will undoubtedly play a pivotal role in shaping future innovations.