This inventor holds 1 USPTO granted patent. Top assignee: United Microelectronics Corp.. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: De-Can Liao: Innovator in CMP Systems
Introduction
De-Can Liao is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent related to chemical mechanical polishing (CMP) systems.
Latest Patents
Liao holds a patent for a "Multi-conditioner arrangement of a CMP system." This invention provides a unique configuration that includes a polishing table, a polishing pad, and multiple carrier heads that hold semiconductor wafers. The arrangement features several conditioners positioned between neighboring carrier heads, which work to recover the surface texture of the polishing pad. This design enhances the lifetime of the polishing pad, reduces wafer-to-wafer differences, and increases spatial coverage. Liao's patent is a testament to his ingenuity and understanding of CMP technology.
Career Highlights
Liao is associated with United Microelectronics Corporation, a leading company in the semiconductor industry. His work there has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in semiconductor manufacturing processes.
Collaborations
Liao has collaborated with notable colleagues such as Ruoh-Haw Chang and Hung-Yu Kuo. These partnerships have likely fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
De-Can Liao's contributions to CMP systems exemplify the importance of innovation in the semiconductor industry. His patent not only showcases his technical expertise but also highlights the collaborative efforts that drive advancements in technology.