The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2002
Filed:
Jun. 06, 2001
Ruoh-Haw Chang, Po-Tzu, TW;
Hung-Yu Kuo, Hsin-Chu Hsien, TW;
Yao-Hung Liu, Chung-Li, TW;
De-Can Liao, Hsin-Chu, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
The present invention provides a multi-conditioner arrangement of a CMP system. The CMP system according to the present invention comprises a polishing table, a polishing pad positioned on the polishing table, a plurality of carrier heads on the polishing pad functioning in holding semiconductor wafers, and a plurality of conditioners positioned between the two neighboring carrier heads on the polishing pad for recovering the surface texture of the polishing pad. Herein, a plurality of conditioners are in a one-to-one arrangement to a plurality of carrier heads, each conditioner producing a back and forth motion in a radiant direction. Therefore, the lifetime of the polishing pad is extended, the wafer-to-wafer difference is reduced, and spatial coverage is increased.