David S. Brannam is a notable inventor based in Cameron Park, California. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on improving the efficiency and functionality of IC packages, which are essential components in modern electronic devices.

Latest Patents

Brannam's latest patents include innovative designs that enhance the electrical interface of integrated circuit packages. One of his notable inventions is the "IC package with edge connect contacts." This apparatus allows the lead pins of an IC package to interface directly with a receptacle of a host data processing system. By housing the IC package within a card casing, this invention eliminates the need for a printed circuit board (PCB) and connector, streamlining the connection process.

Another significant patent is the "IC package with quick connect feature." This invention provides a method for the leads of an IC package to connect directly to a card connector of an IC card. This design also removes the necessity for a PCB and the soldering step, making the manufacturing process more efficient.

Career Highlights

David S. Brannam is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that shape the future of electronics.

Collaborations

Throughout his career, Brannam has collaborated with talented individuals such as Steven R. Eskildsen and Jeffrey C. Franz. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies in the field of integrated circuits.

Conclusion

David S. Brannam's contributions to integrated circuit packaging have made a significant impact on the electronics industry. His innovative patents reflect his commitment to advancing technology and improving the efficiency of electronic devices.