Intel Corporation

David S Brannam

Steven R Eskildsen

Jeffrey C Franz

David M Brown

Russell D Eslick

An apparatus and method for allowing the lead pins of an integrated circuit (IC) package to provide the electrical interface between the IC package and a receptacle of the host data processing system is described. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card and the data processing system into which the IC card is inserted. Thus, the present invention eliminates the need for a printed circuit board (PCB) and connector to provide the interconnection between the IC package and the data processing system.

IC package with edge connect contacts

An apparatus and method allowing the leads of an integrated circuit (IC) package to provide the electrical interface between an IC die housed within the IC package and a card connector of an IC card that is to be inserted into a host data processing system. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card connector and the IC package. The IC card connector then provides the electrical interface between the IC card and the data processing system. The present invention eliminates a need for both a printed circuit board (PCB) and the soldering step of coupling the IC package to the PCB.

IC package with quick connect feature

A nonvolatile memory card includes a power supply input for receiving a device power supply voltage for the memory card and a plurality of memories arranged in an array. Each of the plurality of memories receives the device power supply voltage from the power supply input. Each of the plurality of memories receives a device power supply voltage indication signal that indicates voltage level of the device power supply voltage and configures circuitry within each of the plurality of memories to operate in accordance with the voltage level of the device power supply voltage. A voltage detection circuit is coupled to the power supply input for detecting the voltage level of the device power supply voltage and for generating the device power supply voltage indication signal. A logic is coupled to the voltage detection circuit and each of the plurality of memories for (1) receiving the device power supply voltage indication signal from the voltage detection circuit, (2) applying the device power supply voltage indication signal to each of the plurality of memories such that the circuitry of each of the plurality of memories is configured in accordance with the device power supply voltage indication signal, and (3) supplying data of the nonvolatile memory card with respect to the voltage level of the device power supply voltage to external circuitry.

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Cameron Park, CA, United States of America

David S Brannam