Pasadena, CA, United States of America

David L Bogdanchik

This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignees: Ac Propulsion, Inc., Beijing E. Motor Advance Co. Ltd.. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David L Bogdanchik. Retrieved from https://idiyas.com/inventor/david-l-bogdanchik

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2016-2021

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of David L. Bogdanchik

Introduction

David L. Bogdanchik is a notable inventor based in Pasadena, California. He has made significant contributions to the field of power semiconductor devices, holding two patents that showcase his innovative approach to heat dissipation and packaging methods. His work is essential for improving the efficiency and reliability of electronic devices.

Latest Patents

David's latest patents include a "Heat Dissipation Apparatus and Method for Power Semiconductor Devices." This invention features an improved heat dissipation apparatus designed to limit the temperature of multiple power semiconductors. It incorporates flow balancers that manipulate the hydrodynamic pressure of the coolant fluid, allowing for regulated coolant fluid flow distribution across the heat exchange fins. This design aims to achieve higher heat transfer efficiency through either uniform or custom coolant fluid flow distribution.

Another significant patent is the "Packaging and Cooling Method and Apparatus for Power Semiconductor Devices." This invention comprises a printed circuit board and a semiconductor module that includes a manifold element and power semiconductor devices. The design features thermally conductive plates and serpentine fin elements, which are bonded to the plates to form plate assemblies. These assemblies are installed in the manifold element, facilitating effective heat removal from the power semiconductor devices. The apparatus may also be potted with resin to prevent coolant leakage or sealed using clamped o-rings.

Career Highlights

Throughout his career, David has worked with several companies, including AC Propulsion, Inc. and Beijing E. Motor Advance Co. Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

David has collaborated with notable individuals in the industry, including Lon C. Cooper and Wally Ewald Rippel. These collaborations have likely enriched his work and expanded the impact of his inventions.

Conclusion

David L. Bogdanchik's contributions to the field of power semiconductor devices through his innovative patents demonstrate his commitment to advancing technology. His work not only enhances the efficiency of electronic devices but also sets a foundation for future innovations in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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