The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Oct. 19, 2017
Applicants:
Hung-li Chang, Chino Hills, CA (US);
Lon C. Cooper, Azusa, CA (US);
David L. Bogdanchik, Pasadena, CA (US);
Inventors:
Hung-Li Chang, Chino Hills, CA (US);
Lon C. Cooper, Azusa, CA (US);
David L. Bogdanchik, Pasadena, CA (US);
Assignee:
BEIJING E. MOTOR ADVANCE CO. LTD., Beijing, CN;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/367 (2006.01); H01L 25/11 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/4093 (2013.01); H01L 25/115 (2013.01); H01L 25/112 (2013.01);
Abstract
An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.