The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Aug. 19, 2015
Ac Propulsion, Inc., San Dimas, CA (US);
Wally E. Rippel, Altadena, CA (US);
Paul F. Carosa, Covina, CA (US);
George R. Woody, Anaheim, CA (US);
Lon C. Cooper, Azusa, CA (US);
David L. Bogdanchik, Pasadena, CA (US);
AC Propulsion, Inc., San Dimas, CA (US);
Abstract
A packaging and cooling apparatus for power semiconductor devices comprising a printed circuit board and a semiconductor module. The semiconductor module having a manifold element and a semiconductor element consisting of power semiconductor devices, thermally conductive plates, and serpentine fin elements. The power semiconductor devices and serpentine fin elements are bonded to the thermally conductive plates on opposing sides to form plate assemblies. The plate assemblies are installed in the windows of the manifold element forming the semiconductor module, which allows for heat removal from each of the power semiconductor devices. The terminals of the semiconductor module are received in the holes of the circuit board, and soldered to traces. The packaging and cooling apparatus may be potted with a resin to prevent leakage of coolant or sealing may be achieved by use of clamped o-rings.