Fairport, NY, United States of America

David J Collins

This inventor holds 4 USPTO granted patents. Top assignee: Xerox Corporation. Active years: 1993-1997.

IDiyas Innovation Intelligence. (2026). Inventor Profile: David J Collins. Retrieved from https://idiyas.com/inventor/david-j-collins-rpvvzgqd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 70(Granted Patents)


Company Filing History:


Years Active: 1993-1997

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4 patents (USPTO):Explore Patents

Title: The Innovative Contributions of David J Collins

Introduction

David J Collins is a notable inventor based in Fairport, NY (US). He has made significant contributions to the field of technology, particularly in the area of semiconductor manufacturing. With a total of 4 patents to his name, Collins has demonstrated a commitment to innovation and improvement in his field.

Latest Patents

One of Collins' latest patents is a method of back cutting silicon wafers during a dicing procedure. This improved back cut method enhances the process of separating multiple printheads formed in a silicon wafer. The method involves directing infrared light into the wafer, which is then reflected back through the wafer from alignment fiducial marks. A CCD camera mounted on a dicing saw detects the reflected light, allowing for precise alignment during the dicing process. This innovation enables a back cut operation that partially cuts through the composite wafer, facilitating the subsequent separation of individual printheads.

Another significant patent by Collins is an apparatus for bonding wafer pairs. This invention includes a heated platen surrounded by a pressurization vessel. The heated platen features channels connected to a hole that runs through it. Wafer pairs are placed on the platen's top surface, covered with a rubber mat, and a vacuum is drawn through the hole and channels. The rubber mat compresses the wafer pairs while the platen is heated for the bonding process. The pressurization chamber adds additional bonding pressure, and once sufficiently heated, the platen is liquid cooled to complete the bonding process.

Career Highlights

David J Collins is currently employed at Xerox Corporation, where he continues to contribute to advancements in technology. His work at Xerox has allowed him to apply his innovative ideas in a practical setting, further enhancing the company's capabilities in the semiconductor industry.

Collaborations

Collins has collaborated with notable coworkers such as Robert P Altavela and Ram S Narang. These collaborations have likely contributed to the development of his patents and innovations.

Conclusion

David J Collins is a prominent inventor whose work has significantly impacted the semiconductor manufacturing industry. His innovative patents and contributions at Xerox Corporation highlight his dedication to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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