The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 1994
Filed:
Nov. 02, 1993
Robert P Altavela, Pittsford, NY (US);
Ram S Narang, Fairport, NY (US);
David J Collins, Fairport, NY (US);
Julie A Sims, Rochester, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
A plurality of ink jet printheads are produced from two aligned and bonded substrates by an improved fabrication method. The confronting surface of one of the substrates contains a plurality of linear arrays of heating elements and driver circuitry, and the confronting surface of the other substrate contains a plurality of sets of shallow channel recesses, reservoir recesses, and alignment openings. Prior to mating of the substrates, the substrate surface having the channel recesses is coated with a layer of thermosetting adhesive, and a thick film layer is deposited on the substrate surface having the heating elements and driver circuitry and patterned to provide a plurality of vias therein at predetermined locations. The vias expose the heating elements, provide ink bypass trenches, and provide a number of groupings of small pits. In one embodiment, the alignment openings are used to visually align and mate the substrates, so that each alignment opening is aligned with a respective one of the groups of small pits in the thick film layer. To prevent misalignment between the substrates before the adhesive layer is cured, a UV curable adhesive is inserted into the alignment openings and into each group of small pits in the thick film layer aligned therewith and cured, thus fastening the substrates together. The fastened substrates are placed in a curing oven without lost of alignment therebetween and the thermosetting adhesive is cured. The bonded substrates are then diced into a plurality of individual printheads.