Company Filing History:
Years Active: 2007-2016
Title: David I Amir: Innovator in Interconnect Architecture and Integrated Circuit Design
Introduction
David I Amir is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of electrical engineering, particularly in the areas of interconnect architecture and integrated circuit design. With a total of 2 patents, Amir has demonstrated his expertise and innovative spirit in developing advanced technologies.
Latest Patents
Amir's latest patents include "Interconnect architecture with stacked flex cable" and "Capacitor placement for integrated circuit packages." The first patent describes stacked flex cable assemblies and their manufacture, detailing an assembly that includes a first flex cable and a second flex cable electrically coupled to the first. A connector is also included, which is electrically coupled to the first flex cable, with the first flex cable positioned between the connector and the second flex cable. The second patent focuses on a side-mounted capacitor for a semiconductor die package, where a substrate has a die side for attaching an integrated circuit (IC) and an edge adjacent to the die side. A bypass capacitor is attached to the package substrate edge, enhancing the performance of the integrated circuit.
Career Highlights
David I Amir is currently employed at Intel Corporation, a leading technology company known for its innovations in semiconductor manufacturing and design. His work at Intel has allowed him to contribute to cutting-edge technologies that impact various industries.
Collaborations
Amir has collaborated with notable colleagues, including Tom E Pearson and Terry Dishongh, who share his commitment to advancing technology and innovation in their respective fields.
Conclusion
David I Amir's contributions to interconnect architecture and integrated circuit design highlight his role as an influential inventor in the technology sector. His patents reflect a dedication to innovation that continues to shape the future of electrical engineering.