Intel Corporation

David I Amir

Sanka Ganesan

Damion T Searls

Donald Tiendung Tran

Tom E Pearson

Gary Baxter Long

Terry Dishongh

Timothy M Swettlen

Jill D Murfin

Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Interconnect architecture with stacked flex cable

A side-mounted capacitor for a semiconductor die package is described. In one embodiment, a substrate has a die side to which an IC (integrated circuit) may be attached, and an edge adjacent the die side. A bypass capacitor is attached to the package substrate edge.

Capacitor placement for integrated circuit packages

Growing community of inventors

Portland, OR, United States of America

David I Amir