David H Hinzel

Title: David H. Hinzel: Innovator of MEMS Integration Technology

Introduction

David H. Hinzel, based in Fairfax Station, Virginia, is an accomplished inventor known for his significant contributions to the field of Microelectromechanical Systems (MEMS). With one patent to his name, he has demonstrated a profound understanding of integrating MEMS devices with low-resistivity silicon substrates, which plays a crucial role in enhancing electronic functionalities in various applications.

Latest Patents

Hinzel's patented invention, titled "Method of integrating MEMS device with low-resistivity silicon substrates," outlines a protocol for effectively merging MEMS and non-MEMS circuitry. This innovative method begins with the fabrication of non-MEMS devices on a silicon substrate, followed by the deposition of a thick dielectric layer over these devices. The MEMS devices are then fabricated on top of this dielectric layer, and vias are integrated to connect the MEMS devices with non-MEMS electronics. This strategic interlayer allows the substrate to provide optimal characteristics for non-MEMS components while preserving the performance integrity of the MEMS devices. An additional method proposed by Hinzel involves bonding two separate wafers—one dedicated to MEMS devices and the other to non-MEMS circuitry—facilitating a seamless integration where both types can operate as a single integrated circuit (IC).

Career Highlights

David H. Hinzel's career includes a prominent role at Raytheon Company, where he continues to influence advancements in MEMS technology. His work not only showcases his technical prowess but also his commitment to innovation in electronics. His efforts contribute significantly to the evolution of integrated circuits, which are foundational in modern electronic devices.

Collaborations

Throughout his career, Hinzel has collaborated with notable colleagues, including Charles L. Goldsmith and Lloyd Frederick Linder. These collaborations have likely played an essential role in enhancing the depth and impact of his innovations, illustrating the importance of teamwork in the tech and engineering fields.

Conclusion

David H. Hinzel stands out as a key figure in the realm of MEMS integration technologies. His patented methods reflect a blend of creativity and engineering expertise, paving the way for future innovations in electronic circuit design. With ongoing contributions through his work at Raytheon Company, Hinzel's influence on the industry is expected to grow, further enriching the landscape of modern technology.