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For the Inventor, By the Inventor

Snohomish, WA, United States of America

Dario I Valenzuela

This inventor holds 12 USPTO granted patents and 1 published patent application and 3 EPO patents. Top assignee: The Boeing Company. Active years: 2011-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dario I Valenzuela. Retrieved from https://idiyas.com/inventor/dario-i-valenzuela

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 12 

% Patents Active = 83.3

 

Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Snohomish, WA (US) (2011 - 2018)
  • Everett, WA (US) (2016 - 2019)
  • Mukilteo, WA (US) (2019 - 2021)

Company Filing History:

goldMedal12 out of 23,040 
 
The Boeing Company
 patents

Years Active: 2011-2021

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12 patents (USPTO):Explore Patents
1. 11188688 - Advanced automated process for the wing-to-body join of an aircraft with predictive surface scanning (2021-11-30),
2. 11170495 - Scanning apparatus and method of scanning (2021-11-09),
3. 10739128 - Laser scanner scanning using a computer numerical controlled (CNC) system for movement (2020-08-11),
4. 10488185 - Methods and systems for characterizing a surface of a structural component (2019-11-26),
5. 10275565 - Advanced automated process for the wing-to-body join of an aircraft with predictive surface scanning (2019-04-30),
6. 9958854 - Systems and methods for robotic measurement of parts (2018-05-01),
7. 9599983 - Systems, methods, and apparatus for automated predictive shimming for large structures (2017-03-21),
8. 9266624 - Systems and methods for movement of objects (2016-02-23),
9. 8464434 - Hole and countersink measurement system (2013-06-18),
10. 8272814 - Stringer crawler with attachment mechanism (2012-09-25),
11. 8100611 - Stringer crawler (2012-01-24),
12. 7974722 - Methods and systems for processing surface data for the manufacturing of optimum fit mating parts (2011-07-05),

Title: Dario I Valenzuela: Innovator in Aircraft Engineering

Introduction

Dario I Valenzuela is a prominent inventor based in Snohomish, WA (US). He has made significant contributions to the field of aircraft engineering, holding a total of 12 patents. His innovative work focuses on improving the design and manufacturing processes of aircraft components.

Latest Patents

Valenzuela's latest patents include an advanced automated process for the wing-to-body join of an aircraft with predictive surface scanning. This invention involves measuring the 3D surface contours of both the wing root interface and the wing stub interface to create complete 3D surface profiles. The process calculates a virtual fit between the aircraft wing and body assembly, ensuring precise alignment for optimal performance. Another notable patent is a scanning apparatus and method for predictive shimming, which features a scanning platform capable of moving multiple scanners along various axes to enhance the accuracy of measurements.

Career Highlights

Dario I Valenzuela is currently employed at The Boeing Company, where he applies his expertise in aircraft design and manufacturing. His work has been instrumental in advancing the technology used in modern aircraft, contributing to the safety and efficiency of air travel.

Collaborations

Throughout his career, Valenzuela has collaborated with notable colleagues, including Theodore Martin Boyl-Davis and Darrell Darwin Jones. These partnerships have fostered innovation and have led to the development of groundbreaking technologies in the aerospace industry.

Conclusion

Dario I Valenzuela's contributions to aircraft engineering exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the future of aviation technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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