This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Darin Michael Bushey: Semiconductor Assembly Innovation
Introduction
Darin Michael Bushey is an inventor based in Eagle, Idaho, whose work includes semiconductor device assembly. He is associated with Micron Technology Incorporated and is credited with 1 patent.
Latest Patents
Bushey’s patent, “Semiconductor Assembly Gap Filler,” describes ways to fill gaps within semiconductor device assemblies. The disclosed assembly may include a printed circuit board (PCB) enclosed in a housing, with one or more injection holes for introducing microbead foam into the space between the enclosure and components mounted on the PCB. The foam can occupy at least part of that gap, providing a practical approach to managing space within the assembly.
Career Highlights
Bushey’s listed patent reflects work on the design and construction of semiconductor assemblies. His association with Micron Technology Incorporated connects his inventive work to a company focused on memory and semiconductor technologies.
Collaborations
Among Bushey’s listed coworkers are Jagadeesh Babu Ginjupalli and Charles Everett Siko. Their shared association provides context for the professional environment surrounding his work.
Conclusion
Darin Michael Bushey’s patent on semiconductor assembly gap filling documents an approach that uses injected microbead foam to address gaps around PCB components, highlighting his contribution to semiconductor device assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile