The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Oct. 27, 2023
Micron Technology, Inc., Boise, ID (US);
Jagadeesh Babu Ginjupalli, Fremont, CA (US);
Charles Everett Siko, Boise, ID (US);
Darin Michael Bushey, Eagle, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a printed circuit board (PCB) having a first side and a second side, an enclosure that encloses the PCB and includes one or more injection holes, and microbead foam. The first side and/or the second side of PCB may include a plurality of components. The one or more injection holes may be configured for injecting the microbead foam into a gap between the enclosure and one or more components of the plurality of components. At least a portion of the microbead foam may be located in the gap between the enclosure and the one or more components.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile