Daping Yao

Title: Daping Yao: Innovator in Semiconductor Cleaning Technology

Introduction

Daping Yao is a prominent inventor based in Jiangsu, China. He has made significant contributions to the field of semiconductor technology, particularly in cleaning methods for semiconductor devices. His innovative approach has led to the development of a unique cleaning equipment and method that enhances the efficiency of semiconductor manufacturing.

Latest Patents

Daping Yao holds 1 patent for his invention titled "Semiconductor cleaning equipment and method for cleaning through vias using the same." This patent describes a method for cleaning a through via, which includes several steps. The process involves heating a cleaning fluid to a predetermined temperature, mixing the cleaning liquid with an inert gas, and introducing it into a cleaning cavity. The cleaning liquid is then atomized in an atomizer to spray onto a wafer surface, effectively wetting the inner wall and bottom of the through via before closing the cleaning liquid valve.

Career Highlights

Daping Yao is associated with the National Center for Advanced Packaging Co., Ltd. His work at this institution has allowed him to focus on advancing semiconductor cleaning technologies. His expertise in this area has positioned him as a key figure in the development of innovative solutions for the semiconductor industry.

Collaborations

Daping Yao collaborates with Liqiang Cao, who is also involved in semiconductor research and development. Their partnership has contributed to the advancement of cleaning technologies in the semiconductor field.

Conclusion

Daping Yao's contributions to semiconductor cleaning technology demonstrate his commitment to innovation and excellence. His patent for cleaning through vias showcases his ability to address complex challenges in semiconductor manufacturing. His work continues to influence the industry positively.