Plano, TX, United States of America

Daniel Yong Lin

This inventor holds 6 USPTO granted patents and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2018-2022.

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018-2022

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6 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Daniel Yong Lin

Introduction

Daniel Yong Lin is an accomplished inventor based in Plano, TX, recognized for his significant contributions to the semiconductor industry. With a total of six patents to his name, he has shown a remarkable dedication to innovation and advancement in technology. His work primarily focuses on enhancing the design and functionality of packaged semiconductor devices, making substantial improvements in their performance.

Latest Patents

Daniel's latest inventions include groundbreaking developments in the realm of packaged semiconductor devices. One of his notable patents is for a "Packaged semiconductor device with a reflow wall." This device features a lead frame and a semiconductor device connected by a solder joint, alongside a reflow wall in contact with the solder joint to enhance performance. Another innovative patent by Daniel is for a "Packaged semiconductor device with a particle roughened surface." This invention introduces a particle roughened surface on a portion of the lead frame, which improves adhesion between the molding compound and the lead frame, thus enhancing the overall reliability of the device.

Career Highlights

Daniel Yong Lin works for Texas Instruments Corporation, a leader in the semiconductor industry known for its commitment to innovation and development. Throughout his career, Daniel has contributed to numerous projects that underline his expertise and creative problem-solving abilities in technology and engineering.

Collaborations

In his pursuit of innovation, Daniel collaborates closely with talented colleagues, including Vikas I Gupta and Benjamin Stassen Cook. Together, they push the boundaries of semiconductor technology, ensuring that their collective knowledge and skills lead to further advancements in the field.

Conclusion

Daniel Yong Lin exemplifies the spirit of innovation in the semiconductor industry. With his six patents and continuous efforts to improve the technology landscape, he stands out as a leading inventor. His work not only enhances the function of semiconductor devices but also paves the way for future advancements in the field.

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