The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2022
Filed:
Dec. 13, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Vikas Gupta, Dallas, TX (US);
Daniel Yong Lin, Plano, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4825 (2013.01); H01L 23/3142 (2013.01); H01L 23/49503 (2013.01); H01L 23/49517 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 24/81 (2013.01); H01L 21/4828 (2013.01); H01L 23/3107 (2013.01); H01L 24/13 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16258 (2013.01); H01L 2224/814 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/35121 (2013.01);
Abstract
A packaged semiconductor device includes a lead frame and a semiconductor device. A solder joint is coupled between the lead frame and a terminal on the semiconductor device. A reflow wall is on a portion of the lead frame and is in contact with the solder joint. A molding compound covers portions of the semiconductor device, the lead frame, the solder joint, and the reflow wall.