Ballston Spa, NY, United States of America

Daniel Smith


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Daniel Smith

Introduction

Daniel Smith is a notable inventor based in Ballston Spa, NY (US). He has made significant contributions to the field of semiconductor technology. With a focus on enhancing the performance and reliability of semiconductor devices, Smith's work has garnered attention in the industry.

Latest Patents

Daniel Smith holds a patent for a structure with air gaps extending from a dielectric liner around a through semiconductor via. This innovative design includes a through semiconductor via (TSV) in a semiconductor substrate, surrounded by a dielectric liner. The structure features a plurality of discontinuous air gaps in the semiconductor substrate, which extend away from the dielectric liner. These air gaps are designed to reduce parasitic coupling capacitance and relieve stress in the semiconductor substrate. Smith's patent represents a significant advancement in semiconductor technology, with the potential to improve device performance.

Career Highlights

Smith is currently employed at GlobalFoundries U.S. Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has contributed to the advancement of manufacturing processes and the overall efficiency of semiconductor devices. With a patent portfolio that includes 1 patent, Smith is recognized for his innovative approach to solving complex engineering challenges.

Collaborations

Throughout his career, Daniel Smith has collaborated with talented professionals in the field, including Dewei Xu and Zhuojie Wu. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Daniel Smith's contributions to semiconductor technology exemplify the spirit of innovation. His patent and work at GlobalFoundries U.S. Inc. highlight his commitment to advancing the field. As he continues to push the boundaries of technology, Smith remains a key figure in the industry.

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