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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12451411 B1

PDFFull Text
Date of Patent:
Oct. 21, 2025

Filed:

Jan. 13, 2023

Structure with air gaps extending from dielectric liner around through semicondcutor via

Applicant:

Globalfoundries U.s. Inc., Malta, NY (US);

Inventors:

Dewei Xu, Clifton Park, NY (US);

Zhuojie Wu, Port Chester, NY (US);

Daniel Smith, Ballston Spa, NY (US);

Assignee:

GlobalFoundries U.S. Inc., Malta, NY (US);

Attorneys:

Anthony Canale

Hoffman Warnick LLC

Primary Examiner:

Cheung Lee

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/7682 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/528 (2013.01);
Abstract

A structure includes a through semiconductor via (TSV) in a semiconductor substrate, and a dielectric liner surrounding the TSV and between the TSV and the semiconductor substrate. A plurality of discontinuous air gaps is in the semiconductor substrate extending away from the dielectric liner, e.g., radially. The discontinuous air gaps reduce the parasitic coupling capacitance and relieve stress in the semiconductor substrate.

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Xu, Dewei. (2025). Structure with air gaps extending from dielectric liner around through semicondcutor via (U.S. Patent No. 12451411). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12451411

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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