Daniel Schulman

Title: The Innovations of Daniel Schulman

Introduction

Daniel Schulman is an accomplished inventor based in Hillsboro, OR (US). He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing the performance and reliability of electronic devices.

Latest Patents

Daniel Schulman holds a patent for "Substrate-less electrostatic discharge (ESD) integrated circuit structures." This patent describes innovative methods for fabricating substrate-less ESD integrated circuit structures. The design includes a substrate-less integrated circuit structure featuring a first fin and a second fin protruding from a semiconductor pedestal. An N-type region is present in both fins, while a P-type region is located in the semiconductor pedestal. A P/N junction is formed between the N-type and P-type regions, situated on or within the semiconductor pedestal. This invention aims to improve the robustness of integrated circuits against electrostatic discharge.

Career Highlights

Daniel Schulman is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that shape the future of electronics.

Collaborations

Daniel has collaborated with notable colleagues such as Biswajeet Guha and Brian Joseph Greene. Their combined expertise has fostered innovation and development in the field of integrated circuits.

Conclusion

Daniel Schulman's contributions to the field of integrated circuits, particularly through his patent on substrate-less ESD structures, highlight his role as a key innovator in technology. His work continues to influence the design and reliability of electronic devices.