Schaumburg, IL, United States of America

Daniel Jacklinski

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Laird Technologies Gmbh. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daniel Jacklinski. Retrieved from https://idiyas.com/inventor/daniel-jacklinski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Daniel Jacklinski

Introduction

Daniel Jacklinski is an accomplished inventor based in Schaumburg, IL (US). He has made significant contributions to the field of electronic components through his innovative designs and patents. His work focuses on enhancing the functionality and efficiency of electronic devices.

Latest Patents

One of Daniel Jacklinski's notable patents is for a "Board level shield including an integrated heat sink." This patent describes a shielding assembly that includes both a board level shield and a heat sink. The assembly is designed to be mounted on a printed circuit board, providing both electromagnetic interference (EMI) shielding and thermal management for heat-generating electronic components. The heat sink features at least one pin, while the shield includes complementary perforations, allowing for effective thermal energy transfer.

Career Highlights

Daniel Jacklinski is currently employed at Laird Technologies GmbH, where he continues to develop innovative solutions for electronic applications. His expertise in EMI shielding and thermal management has positioned him as a valuable asset in the industry. With a total of 1 patent, he demonstrates a commitment to advancing technology in his field.

Collaborations

Throughout his career, Daniel has collaborated with talented individuals such as Timothy M Wrona and Gerald Robert English. These partnerships have contributed to the successful development of his innovative projects.

Conclusion

Daniel Jacklinski's contributions to the field of electronics through his patent for a board level shield with an integrated heat sink exemplify his innovative spirit. His work continues to influence the design and functionality of electronic components, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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