The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Apr. 06, 2018
Applicant:

Laird Technologies, Inc., Earth City, MO (US);

Inventors:

Timothy M. Wrona, Schaumburg, IL (US);

Gerald R. English, Glen Ellyn, IL (US);

Daniel Jacklinski, Schaumburg, IL (US);

Assignee:

LAIRD TECHNOLOGIES, INC., Chesterfield, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 9/00 (2006.01); H01L 23/34 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01); H01L 23/34 (2013.01); H05K 7/2039 (2013.01); H05K 7/20918 (2013.01); H05K 7/20945 (2013.01); H05K 9/0032 (2013.01);
Abstract

A shielding assembly is disclosed, the assembly including at least a board level shield and a heat sink. The assembly may include a board level shield that includes both a lid and a fence, and may also include a thermal interface material, where the assembly may be mounted on a printed circuit board to provide both EMI shielding and thermal management of heat-generating electronic components or heat sources on the circuit board. The heat sink includes at least one pin, and the shield includes at least one complementary perforation relative to the pin, such that an assembled device of the disclosure provides both EMI shielding and thermal management while permitting the transfer of thermal energy via the heat sink pin through the board level shield perforation.


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