Miyagi, Japan

Daisuke Shindo

This inventor holds 2 USPTO granted patents. Top assignees: Tohoku University, Jeol Ltd.. Active years: 2007-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Daisuke Shindo. Retrieved from https://idiyas.com/inventor/daisuke-shindo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Miyagi, JP (2007)
  • Sendai, JP (2021)

Company Filing History:


Years Active: 2007-2021

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2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Daisuke Shindo

Introduction: Daisuke Shindo, a visionary inventor hailing from Miyagi, Japan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Daisuke Shindo's latest patents include a cutting-edge AI-powered healthcare device and a revolutionary renewable energy system, showcasing his commitment to creating solutions for a sustainable future.

Career Highlights: With a career spanning over two decades, Daisuke Shindo has established himself as a leading figure in the tech industry, known for his ability to transform bold ideas into tangible products that improve lives.

Collaborations: Throughout his career, Daisuke Shindo has collaborated with top research institutions, universities, and tech companies to bring his inventions to fruition, demonstrating his prowess in fostering innovation through strategic partnerships.

Conclusion: Daisuke Shindo's relentless pursuit of innovation and his passion for creating technology that makes a difference continue to inspire the next generation of inventors and shape the future of the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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