Seongnam-si, South Korea

Dae-Woo Kim

USPTO Granted Patents = 9 

Average Co-Inventor Count = 3.8

ph-index = 3

Forward Citations = 15(Granted Patents)


Location History:

  • Suwon, KR (1998 - 2000)
  • Yongin-si, KR (2010)
  • Seongnam-si, KR (2022 - 2024)

Company Filing History:


Years Active: 1998-2025

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9 patents (USPTO):Explore Patents

Title: Dae-Woo Kim: Innovator in Semiconductor Technology

Introduction

Dae-Woo Kim is a prominent inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work primarily focuses on innovative semiconductor packages that enhance performance and efficiency.

Latest Patents

One of Dae-Woo Kim's latest patents involves a semiconductor package that includes a redistribution substrate and a first memory chip. This memory chip comprises a first base layer, a first circuit layer on its top surface, and a first via that connects the first circuit layer to the redistribution substrate. Additionally, a logic chip is provided on the first memory chip, with a first molding layer surrounding it. Notably, the outer side surface of the first molding layer is coplanar with the side surface of the logic chip. At the interface between the logic chip and the first memory chip, a first chip pad in the first circuit layer and a second chip pad of the logic chip are formed from the same material, creating a unified structure.

Another patent describes a semiconductor package that includes two semiconductor chips with distinct widths. The first semiconductor chip features a wiring layer and a through via for power, while the second semiconductor chip has its own wiring layer and through via. This design allows for efficient power distribution between the two chips, enhancing their functionality.

Career Highlights

Dae-Woo Kim is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge semiconductor technologies that are crucial for modern electronic devices. His innovative designs have contributed to the advancement of semiconductor packaging, which is essential for improving device performance.

Collaborations

Throughout his career, Dae-Woo Kim has collaborated with notable colleagues, including Hyuekjae Lee and Sang Cheon Park. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies in the semiconductor field.

Conclusion

Dae-Woo Kim's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements in semiconductor packaging continue to influence the future of electronic devices.

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