Dae-Jung Byun

Title: Innovations of Dae-Jung Byun

Introduction

Dae-Jung Byun is a notable inventor based in Busan, South Korea. He has made significant contributions to the field of printed circuit boards, holding a total of 2 patents. His work focuses on improving manufacturing methods and enhancing the functionality of electronic components.

Latest Patents

Dae-Jung Byun's latest patents include a printed circuit board and a method of manufacturing the same, as well as an apparatus for perforating via holes. The first patent discloses a method that involves forming a first circuit pattern on an insulation substrate, stacking a metal layer, and creating a via that connects the via land with the metal layer. This innovative approach helps prevent short-circuiting and reduces defect rates, ultimately contributing to cost savings in production. The second patent outlines a method for manufacturing a multilayer printed circuit board, which is designed to be suitable for slim modules by strategically removing insulation layers.

Career Highlights

Dae-Jung Byun is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop cutting-edge technologies in the electronics sector. His expertise in printed circuit board design and manufacturing has positioned him as a valuable asset to his company.

Collaborations

Throughout his career, Dae-Jung Byun has collaborated with notable colleagues, including Kwang-Soo Park and Dong-Sam You. These partnerships have fostered innovation and contributed to the advancement of their projects.

Conclusion

Dae-Jung Byun's contributions to the field of printed circuit boards exemplify the importance of innovation in technology. His patents not only enhance manufacturing processes but also pave the way for more efficient electronic devices.