The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2011
Filed:
Nov. 08, 2007
Kwang-soo Park, Busan, KR;
Sim-hwan Park, Busan, KR;
Jeong-yeon Jeong, Busan, KR;
Dae-jung Byun, Busan, KR;
Kwang-Soo Park, Busan, KR;
Sim-Hwan Park, Busan, KR;
Jeong-Yeon Jeong, Busan, KR;
Dae-Jung Byun, Busan, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board, a method of manufacturing the printed circuit board, and an apparatus for perforating via holes are disclosed. By use of a method of manufacturing a printed circuit board that includes forming a first circuit pattern, which includes a reference mark and a via land, on one surface of an insulation substrate; stacking a metal layer on the insulation layer; opening a first window in the metal layer in correspondence with the reference mark; and forming a via which electrically connects the via land with the metal layer, by irradiating light towards the other surface of the insulation substrate and identifying the reference mark through the first window, the occurrence of short-circuiting is prevented in forming vias for electrical interconnection between circuit patterns in a printed circuit board, and as the defect rate caused by eccentricity between insulation layers may be reduced, aspects of the invention may contribute to reducing costs.