The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2010
Filed:
Jan. 07, 2008
Kwang-soo Park, Busan, KR;
Dong-sam You, Chungcheongnam-do, KR;
Bong-soo Kim, Gyeongsangnam-do, KR;
Myung-gun Chong, Changwon-si, KR;
Dae-jung Byun, Busan, KR;
Kwang-Soo Park, Busan, KR;
Dong-Sam You, Chungcheongnam-do, KR;
Bong-Soo Kim, Gyeongsangnam-do, KR;
Myung-Gun Chong, Changwon-si, KR;
Dae-Jung Byun, Busan, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.