The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7665206 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 23, 2010

Filed:

Jan. 07, 2008
Applicants:

Kwang-soo Park, Busan, KR;

Dong-sam You, Chungcheongnam-do, KR;

Bong-soo Kim, Gyeongsangnam-do, KR;

Myung-gun Chong, Changwon-si, KR;

Dae-jung Byun, Busan, KR;

Inventors:

Kwang-Soo Park, Busan, KR;

Dong-Sam You, Chungcheongnam-do, KR;

Bong-Soo Kim, Gyeongsangnam-do, KR;

Myung-Gun Chong, Changwon-si, KR;

Dae-Jung Byun, Busan, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board and a method of manufacturing a printed circuit board are disclosed. Using a method of manufacturing a printed circuit board, which includes: forming a multilayer board by alternately stacking circuit pattern layers and insulation layers such that a predetermined thickness of a partial area has only insulation layers stacked therein; and removing insulation layers from the partial area of the multilayer board, a printed circuit board can be manufactured that is suitable for a slim module.


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Park, Kwang-Soo. (2010). Printed circuit board and manufacturing method thereof (U.S. Patent No. 7665206). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7665206

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