Curtis Wortman

Title: Innovations by Curtis Wortman

Introduction

Curtis Wortman is an accomplished inventor based in San Jose, CA. He has made significant contributions to the field of integrated circuits, holding a total of 3 patents. His work focuses on enhancing the functionality and efficiency of multichip packages.

Latest Patents

One of his latest patents is titled "Periphery shoreline augmentation for integrated circuits." This innovation involves a multichip package that includes a main die mounted on a substrate. The main die is coupled to one or more transceiver dies, also mounted on the substrate. It features universal interface blocks designed to interface with on-package memory devices or expansion dies. The expansion die incorporates external memory interface components for communication with off-package memory devices and bulk random-access memory components for data storage. Additionally, smaller input-output blocks such as GPIO or LVDS interfaces are integrated within the core fabric of the main die, ensuring efficient routing and clock source provision.

Career Highlights

Curtis Wortman is currently employed at Intel Corporation, where he continues to innovate and develop advanced technologies. His expertise in integrated circuits has positioned him as a key player in the tech industry.

Collaborations

Throughout his career, Curtis has collaborated with notable colleagues, including Chee Hak Teh and Jeffrey Erik Schulz. These partnerships have contributed to the advancement of his projects and innovations.

Conclusion

Curtis Wortman exemplifies the spirit of innovation in the field of integrated circuits. His contributions through patents and collaborations continue to shape the future of technology.