The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 2020

Filed:

Oct. 31, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventor:

Curtis Stephen Wortman, San Jose, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01); H04J 3/02 (2006.01); H04L 12/46 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4027 (2013.01); H04J 3/02 (2013.01); H04L 12/4625 (2013.01); G06F 2213/0026 (2013.01);
Abstract

Methods and systems that uses time-division multiplexing to send two or more protocols over an interconnect bridge between two die. The two die communicate, using the interconnect bridge, using a first protocol and a second protocol. The first protocol is a down-configured version of a high-bandwidth version passable through the interconnect bridge. Additional data is interleaved over the interconnect bridge. The additional data is received at a first die of the two die using a second protocol, and the first die interleaves the additional data into communications between the first and second die using time-division multiplexing.


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