This inventor holds 1 USPTO granted patent. Top assignee: Tokyo Electron Limited. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Cory Waida: Innovator in Thin Film Technology
Introduction
Cory Waida is a notable inventor based in Sand Lake, NY (US). He has made significant contributions to the field of thin film technology, particularly through his innovative patent.
Latest Patents
Cory Waida holds a patent titled "Method and system for increasing tensile stress in a thin film using collimated electromagnetic radiation." This patent describes a method and system for enhancing the tensile stress in thin films formed on substrates, such as silicon nitride films. The process involves exposing the thin film to collimated electromagnetic (EM) radiation, which can have a wavelength of less than about 500 nm. This technique allows for anisotropic exposure of the film, which can be either planar or non-planar, such as a nitride film formed over a NMOS gate.
Career Highlights
Cory Waida is associated with Tokyo Electron Limited, a leading company in the semiconductor industry. His work focuses on advancing technologies that improve the performance and reliability of thin films used in various applications.
Collaborations
Cory has collaborated with notable colleagues, including Igeta Masonobu and Gert J Leusink, who share his passion for innovation in the field of thin film technology.
Conclusion
Cory Waida's contributions to thin film technology through his patent demonstrate his commitment to innovation and excellence in the semiconductor industry. His work continues to influence advancements in this critical area of technology.