Cory A Runyan

Title: Innovations by Cory A. Runyan

Introduction

Cory A. Runyan is a notable inventor based in Folsom, CA, who has made significant contributions to the field of microelectronics. With a total of 3 patents to his name, Runyan has demonstrated a commitment to advancing technology through innovative solutions.

Latest Patents

Runyan's latest patents include groundbreaking inventions such as a high-density multiple die structure. This patent provides apparatus and methods for integrated circuit packages that feature a low z-height. The method involves mounting a first integrated circuit sub-package to a first package substrate, which spans an opening of the substrate, and subsequently mounting a second integrated circuit package to a second package substrate. The integration of these components allows for efficient use of space and improved performance. Another notable patent is focused on microelectronic device stacks that incorporate interior window wirebonding. This innovation allows for a microelectronic package to be fabricated with a die stack that includes an opening or 'window' formed through the first microelectronic die. This design facilitates electronic communication between the dies and the substrate, enhancing the overall functionality of the microelectronic package.

Career Highlights

Cory A. Runyan is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has positioned him at the forefront of microelectronic innovation, where he continues to develop cutting-edge technologies.

Collaborations

Runyan has collaborated with esteemed colleagues such as Min-Tih Ted Lai and Florence R. Pon, contributing to a dynamic environment of innovation and creativity within the field.

Conclusion

Cory A. Runyan's contributions to microelectronics through his patents and work at Intel Corporation highlight his role as a key innovator in the industry. His inventions not only advance technology but also pave the way for future developments in integrated circuits and microelectronic devices.