Corey Ciullo

Title: **Corey Ciullo: Innovating Copper Electroplating Techniques**

Introduction

Corey Ciullo, an accomplished inventor based in Brookline, MA, has made significant contributions to the field of electroplating. With her expertise and innovative mindset, she holds a patent that enhances the process of copper electroplating, showcasing her role as a vital player in the industry.

Latest Patents

Ciullo's noteworthy patent is titled "Method of electroplating copper into a via on a substrate from an acid copper electroplating bath." This invention addresses the challenges associated with filling vias with copper, utilizing copper electroplating baths that include primary alcohol alkoxylate block copolymers and ethylene oxide/propylene oxide random copolymers. The specific HLB ranges of these compounds ensure that the resulting copper deposits are substantially void-free and devoid of surface defects, representing a significant advancement in manufacturing technologies.

Career Highlights

Currently, Corey Ciullo is associated with Rohm and Haas Electronic Materials LLC, where she continues to explore innovative solutions in the realm of electronics materials. Throughout her career, Ciullo has demonstrated a keen ability to merge scientific knowledge with practical applications, helping to propel advancements in electroplating techniques.

Collaborations

In her professional journey, Ciullo collaborates with talented individuals such as Matthew A. Thorseth and Mark Scalisi. These partnerships foster a dynamic working environment, allowing for the cross-pollination of ideas and the development of groundbreaking products within the field.

Conclusion

Corey Ciullo's contributions to the innovation of copper electroplating not only underline her individual capabilities as an inventor but also reflect the collaborative spirit of her workplace. As she continues to work at Rohm and Haas Electronic Materials LLC, her advancements pave the way for enhancing technology and efficiency in the electronics industry.